Electronic package

ABSTRACT

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

BACKGROUND 1. Technical Field

The present disclosure relates to a semiconductor packaging process, andmore particularly, to an electronic package with a shielding structure.

2. Description of Related Art

With the rapid growths in the electronic industry, high integration(e.g., compact, light, thin, etc.) is one of the goals for many high-endelectronic products. The advancements in packaging technology havebrought about a myriad of chip packaging techniques as well assemiconductor packages with ever smaller sizes or volumes to meet thegoals of compact, thin, light semiconductor packages.

In order to satisfy these goals, packages are disposed more densely onthe electronic products. However, this may lead to electromagneticinterference (EMI) between the packages.

In order to address the EMI issue between the various electronicpackages, an outer shield is usually disposed during the packagingprocess of a package to avoid the EMI between various packages.

As shown in FIG. 1 , a conventional semiconductor package 1 includes atleast one semiconductor component 11, 11′ disposed on a packagesubstrate 10. The semiconductor components 11, 11′ are then encapsulatedby an encapsulant 13. Thereafter, a shield 12 is bonded onto the packagesubstrate 10 via a conductive adhesive 120, so that the semiconductorcomponents 11, 11′ can be covered by the shield 12.

However, in the conventional semiconductor package 1, the adhesivenessof the conductive adhesive 120 may be degraded due to temperature,humidity or other environmental factors, and the shield 12 may easilypeel off or fall off from the package substrate 10.

Furthermore, when the shield 12 is secured on the encapsulant 13, thesize and shape of the shield 12 has to conform with the size and shapeof the encapsulant 13 with high accuracy. As a result, there needs to bea certain level of accuracy in the relative positions of the shield 12and the encapsulant 13 during the manufacturing process. This leads tohigher cost and longer manufacturing time.

In addition, since the sizes and the shapes of the shield 12 and theencapsulant 13 have to match, if semiconductor components 11, 11′ ofdifferent sizes and shapes are present, then a new shield of a differentsize and shape may be needed. In this case, a new mold needs to be madeto produce an encapsulant 13 of a different size and shape, thusincreasing manufacturing cost and time.

Therefore, there is a need for a solution that addresses theaforementioned issues in the prior art.

SUMMARY

In view of the aforementioned shortcomings of the prior art, the presentdisclosure provides an electronic package, which may comprise: acarrier; an electronic component disposed on the carrier; and ashielding structure including a plurality of bonding wire portions, eachof the bonding wire portions being provided on the carrier by continuouswire bonding, wherein the bonding wire portion has an arc line shape andis defined with a first line segment, a second line segment and a curvedsegment connected with the first and second line segments.

In the aforementioned electronic package, a length of the first linesegment and a length of the second line segment are not equal.

In the aforementioned electronic package, the bonding wire portion is asingle line segment.

In the aforementioned electronic package, the shielding structure formsa closed loop.

The aforementioned electronic package may further include a packaginglayer encapsulating the electronic component and the shieldingstructure. For example, the shielding structure is partially exposedfrom the packaging layer. The aforementioned electronic package mayfurther include a shielding layer formed on the packaging layer.Furthermore, the shielding layer is electrically connected with thecarrier. The shielding layer is in contact with the shielding structure.Alternatively, the shielding layer is not in contact with the shieldingstructure.

In the aforementioned electronic package, all of the plurality ofbonding wire portions are continuously wire bonded to integrally formthe shielding structure.

In the aforementioned electronic package, the wire bonding between twoadjacent ones of the plurality of bonding wire portions is interruptedto form a plurality of discontinuous segments of the shieldingstructure.

The present disclosure further provides an electronic package, which mayinclude: a carrier; an electronic component disposed on the carrier; anda shielding structure including a plurality of bonding wire portions,each of the bonding wire portions being provided on the carrier bycontinuous wire bonding, wherein the bonding wire portion has a firstbonding wire and a second bonding wire, the first bonding wire is in anarc line shape and one end of the first bonding wire is disposedcorrespondingly with the second bonding wire, and the second bondingwire is a single line segment and disposed on the carrier.

In the aforementioned electronic package, a height of the first bondingwire relative to the carrier is lower than a height of the secondbonding wire relative to the carrier.

In the aforementioned electronic package, the first bonding wire isdefined with a first line segment, a second line segment and a curvedsegment connected with the first and second line segments.

In the aforementioned electronic package, the second bonding wire hasone end bonded to a location to which the first bonding wire isconnected.

The aforementioned electronic package may further include a packaginglayer encapsulating the electronic component and the shieldingstructure. For example, the shielding structure is partially exposedfrom the packaging layer. The aforementioned electronic package mayfurther include a shielding layer formed on the packaging layer.Furthermore, the shielding layer is electrically connected with thecarrier. The shielding layer is in contact with the shielding structure.Alternatively, the shielding layer is not in contact with the shieldingstructure.

As can be seen from the above, the electronic package of the presentdisclosure employs the bonding wire portions bonded on the carrier asthe shielding structure to prevent the influences of temperature,humidity and other environmental factors. Thus, compared to the priorart, the electronic package of the present disclosure effectivelyprevents the shielding structure from peeling off or falling off fromthe carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a conventionalsemiconductor package.

FIG. 2A is a schematic top view of an electronic package in accordancewith a first embodiment of the present disclosure.

FIG. 2A′ is a schematic cross-sectional view of the electronic packagein accordance with the first embodiment of the present disclosure takenfrom one perspective.

FIG. 2B is a schematic side view depicting the manufacturing of ashielding structure in FIG. 2A.

FIG. 2C is a schematic diagram depicting another aspect of FIG. 2B.

FIG. 3A is a schematic cross-sectional view of the electronic package inaccordance with the first embodiment of the present disclosure takenfrom another perspective.

FIG. 3A′ is a schematic cross-sectional view depicting another aspect ofFIG. 3A.

FIG. 3B is a schematic cross-sectional view of an electronic package inaccordance with a second embodiment of the present disclosure.

FIG. 3C is a schematic cross-sectional view of an electronic package inaccordance with a third embodiment of the present disclosure.

FIG. 4A is a partial schematic top view of an electronic package inaccordance with a fourth embodiment of the present disclosure.

FIG. 4B is a partial perspective view of FIG. 4A.

FIGS. 4C and 4C′ are schematic cross-sectional views of differentaspects of FIG. 4A.

FIG. 5 is a schematic cross-sectional view of an electronic package inaccordance with a fifth embodiment of the present disclosure.

FIG. 6 is a schematic top view of an electronic package in accordancewith a sixth embodiment of the present disclosure.

DETAILED DESCRIPTION

The implementations of present disclosure are illustrated using thefollowing embodiments. One of ordinary skill in the art can readilyappreciate the other advantages and technical effects of the presentdisclosure upon reading the disclosure of this specification.

It should be noted that the structures, ratios, sizes shown in thedrawings appended to this specification are to be construed inconjunction with the disclosure of this specification in order tofacilitate understanding of those skilled in the art. They are notmeant, in any ways, to limit the implementations of the presentdisclosure, and therefore have no substantial technical meaning. Withoutaffecting the effects created and objectives achieved by the presentdisclosure, any modifications, changes or adjustments to the structures,ratio relationships or sizes, are to be construed as fall within therange covered by the technical contents disclosed herein. Meanwhile,terms, such as “first,” “second,” “above,” “a,” “an,” and the like, arefor illustrative purposes, and are not meant to limit the range in whichthe present disclosure can be implemented. Any variations ormodifications made to their relative relationships, without changing thesubstantial technical contents, are also to be construed as within therange in which the present disclosure can be implemented.

FIG. 2A is a schematic top view depicting an electronic package 2 inaccordance with a first embodiment the present disclosure. Theelectronic package 2 includes a carrier 20, at least one electroniccomponent 21 disposed on the carrier 20, and a shielding structure 22disposed on the carrier 20 and shielding around the periphery of theelectronic component 21.

In an embodiment, as shown in FIG. 2A′, the electronic package 2 furtherincludes a packaging layer 23 covering the electronic component 21 andthe shielding structure 22, and a shielding layer 24 disposed on thepackaging layer 23.

The carrier 20 includes a first side 20 a and a second side 20 bopposite to each other, and a chip placement area A and a periphery areaB surrounding the chip placement area A are defined on the first side 20a.

In an embodiment, the carrier 20 is a package substrate with a corelayer and a circuit structure or a coreless circuit structure. Thecircuit structure forms a circuit layer 200, such as a fan-outredistribution layer (RDL) on a dielectric material. The dielectricmaterial can be polybenzoxazole (PBO), polyimide (PI), a prepreg (PP),etc. It can be appreciated that the carrier 20 can also be other typesof carrier units for carrying electronic components (e.g., chips), suchas a lead-frame, a silicon interposer or the like, and the presentdisclosure is not limited as such.

Moreover, the circuit layer 200 includes a plurality of electricalcontact pads 201 disposed on the chip placement area A and at least oneoptional function pad 202 disposed on the periphery area B.

In addition, the enlarged cross-sectional structure shown in FIG. 2A′ isa cross-sectional view of the structure shown in FIG. 2A cut along lineX-X, and the locally enlarged cross-sectional structure shown in FIG. 3Ais a cross-sectional view of the structure shown in FIG. 2A cut alongline Y-Y.

The electronic component 21 is disposed on the chip placement area A ofthe first side 20 a of the carrier 20.

In an embodiment, the electronic component 21 may be an activecomponent, a passive component, or a combination of both. The activecomponent can be, for example, a semiconductor chip, and the passivecomponent can be, for example, a resistor, a capacitor or an inductor.For example, the electronic component 21 is a semiconductor chip with anactive face 21 a and a non-active face 21 b opposite to the active face21 a. The electronic component 21, via its non-active face 21 b, isdisposed on the first side 20 a of the carrier 20 through an adhesive28. The active face 21 a includes a plurality of electrode pads 210 thatare electrically connected to the electrical contact pads 201 via aplurality of wires 211 by wire bonding. Alternatively, the electroniccomponent 21 can be electrically connected to the electrical contactpads 201 of the carrier 20 through a plurality of conductive bumps (notshown) in a flip-chip manner and the conductive bumps are encapsulatedby an underfill (not shown). Alternatively, the electrode pads 210 ofthe electronic component 21 can directly come into contact with theelectrical contact pads 201 to electrically connect with the circuitlayer 200. However, it can be appreciated that the way in which theelectronic component 21 is electrically connected with the carrier 20 isnot limited to those described above.

The shielding structure 22 includes a plurality of bonding wire portions220 (as shown in FIG. 3A), and the plurality of bonding wire portions220 are placed on the periphery area B of the first side 20 a of thecarrier 20.

In an embodiment, the bonding wire portions 220 are bonded onto thefunction pads 202 of the carrier 20, such that the bonding wire portions220 are electrically connected with the carrier 20. For example, thebonding wire portions 220 are metal wires used for wire bonding. Each ofthe two ends of a bonding wire portion 220 is bonded to a function pad202 of the carrier 20 as shown in FIG. 3A.

Moreover, as shown in FIG. 3A, each of the bonding wire portions 220 ofthe shielding structure 22 is formed by continuous wire bonding in theshape of an arc or an closed arc loop, for example. A single bondingwire portion 220 is defined with a first line segment 221, a second linesegment 222 and a curved segment 220 c connecting the first line segment221 and the second line segment 222. As an example, the first linesegment 221 and the second line segment 222 have different lengths. Inan embodiment, the length of the first line segment 221 is shorter thanthat of the second line segment 222.

Furthermore, continuous wire bonding of the shielding structure 22involves, for example, pulling a gold wire from a function pad 202 toanother function pad 202 by a nozzle (not shown) of a wire bondingmachine (not shown) and stitch bonding the gold wire before cutting offas shown in FIG. 2B. Then, another gold wire is pulled from the cut-offlocation 220 b by the nozzle. Alternatively, as shown in FIG. 2C, aftercutting off, a ball 220 a is formed at the cut-off location 220 b by thenozzle before pulling another gold wire.

In addition, the plurality of bonding wire portions 220 can becontinuously wire bonded if needed, so that the shielding structure 22is integrally formed (as shown in FIG. 3A). Alternatively, as shown inFIG. 3A′, wire bonding between any two adjacent bonding wire portions220 can be interrupted, so that the shielding structure 22′ is in theform of discontinuous segments.

The packaging layer 23 is disposed on the first side 20 a of the carrier20 to encapsulate the electronic component 21 and the shieldingstructure 22.

In an embodiment, the packaging layer 23 can be made from an insulatingmaterial, for example, polyimide, a dry film, an epoxy resin, or amolding compound. For example, the packaging layer 23 can be formed onthe first side 20 a of the carrier 20 by liquid compound encapsulation,injection, lamination, compression molding, and the like.

Moreover, the packaging layer 23 is defined with a first surface 23 aand a second surface 23 b opposite to each other. The packaging layer 23is bonded onto the first side 20 a of the carrier 20 via its firstsurface 23 a. Therefore, the bonding wire portions 220 can be exposedfrom the second surface 23 b of the packaging layer 23 if needed, asshown in FIG. 3A. For example, a portion of the second surface 23 b ofthe packaging layer 23 can be removed, such that the curved segment 220c of a bonding wire portion 220 can protrude out of the second surface23 b of the packaging layer 23, such that the curved segment 220 c isexposed from the second surface 23 b of the packaging layer 23.Alternatively, the bonding wire portion 220 can be not exposed from thepackaging layer 23 as shown in an electronic package 2′ in accordancewith a second embodiment of the present disclosure in FIG. 3B.

Furthermore, in an electronic package 3 in accordance with a thirdembodiment of the present disclosure shown in FIG. 3C, during theremoval process, a portion of the second surface 23 b of the packaginglayer 23 as well as the curved segment 220 c of the bonding wireportions 220 are removed, such that first line segments 321 and secondline segments 322 of the bonding wire portions 320 are separated andused as the shielding structure 32, and the ends of the first linesegments 321 and the ends of the second line segments 322 are exposedfrom the second surface 23 b of the packaging layer 23, wherein thebonding wire portions 320 are formed on the same function pad 302.

In addition, the periphery area B of the carrier 20 can be provided witha plurality of function pads 202, 402 if needed, so that a shieldingstructure 42 forms a closed loop, as shown in an electronic package 4 inaccordance with a fourth embodiment of the present disclosure in FIG.4A. As an example, bonding wire portions 220 based on FIG. 3A or 3B canform the closed-loop shielding structure 42 by continuous wire bondingon the periphery area B on at least one side of the chip placement areaA, as shown in FIG. 4B, wherein the bonding wire portions 420 can beexposed from the second surface 23 b of the packaging layer 23 (as shownin FIG. 4C) or not exposed from the second surface 23 b of the packaginglayer 23 (as shown in FIG. 4C′). In an embodiment, the bonding wireportions 420 are arranged in two crisscross rows and weaved into a fenceor a mesh to provide better shielding.

The shielding layer 24 is formed on the second surface 23 b of thepackaging layer 23 and electrically connected to the circuit layer 200of the carrier 20.

In an embodiment, the shielding layer 24 can be made of a conductivematerial or other suitable shielding material, and can be formed on thesecond surface 23 b of the packaging layer 23 by sputtering or othermethods. It can be appreciated that there are numerous constructions ofthe shielding layer 24 and numerous ways of producing them, and there isno special restrictions.

Moreover, the shielding layer 24 is in contact with the shieldingstructure 22, 32, 42 (e.g., the bonding wire portions 220, 320, 420shown in FIG. 3A, 3C or 4C) to indirectly electrically connect with thecircuit layer 200 of the carrier 20. In other embodiments, if theshielding structure 22, 42 is not exposed from the packaging layer 23(e.g., the bonding wire portions 220, 420 shown in FIG. 3B or 4C′), theshielding layer 24 can extend to where the carrier 20 is exposed (e.g.,a side 20 c of the carrier 20) to make contact with a grounded portion203 of the circuit layer 200, such that the shielding layer 24 isdirectly electrically connected with the circuit layer 200 of thecarrier 20.

It can be appreciated that there are numerous ways in which theshielding layer 24 can be electrically connected with the carrier 20,and the present disclosure is not limited to the above.

FIG. 5 is a partial cross-sectional view of an electronic package 5 inaccordance with a fifth embodiment of the present disclosure. Thisembodiment is different from the previous embodiments in the design ofthe shielding structure, whereas the rest of the components are the sameor similar and will not be repeated hereinafter for conciseness.

As shown in FIG. 5 , a shielding structure 52 is formed with bondingwire portions 520 based on the bonding wire portions 220, 320 shown inFIG. 3B or 3C.

In an embodiment, the bonding wire portion 520 includes a first bondingwire 521 and a second bonding wire 522. The height h of the firstbonding wire 521 relative to the carrier 20 is lower than the height Hof the second bonding wire 522 relative to the carrier 20, such that thefirst bonding wire 521 is not exposed from the packaging layer 23,whereas the second bonding wire 522 is exposed from the second surface23 b of the packaging layer 23.

Moreover, the two opposite ends of the first bonding wire 521 arerespectively bonded onto two function pads 202, 202′ to form an arc or aclosed arc loop. The first bonding wire 521 is defined with a first linesegment 521 a of a shorter length, a second line segment 521 b of alonger length and a curved segment 521 c connected with the first linesegment 521 a and the second line segment 521 b. One end of the secondline segment 521 b is located correspondingly to the second bonding wire522.

Furthermore, the second bonding wire 522 is a single line segment thatdisposes on the first side 20 a of the carrier 20. One end of the secondbonding wire 522 is bonded onto the function pad 202′ to which thesecond line segment 521 b of the first bonding wire 521 is connected,while the other end thereof is exposed from the second surface 23 b ofthe packaging layer 23.

It can be appreciated that, based on the first to the fifth embodiments,different shielding structures 22, 32, 42, 52 can be simultaneouslyprovided around the periphery of the chip placement area A of thecarrier 20 (i.e., the periphery area B), as shown in an electronicpackage 6 in accordance with a sixth embodiment of the presentdisclosure shown in FIG. 6 , and non-continuous wire boning is usedbetween each of the shielding structures 22, 32, 42, 52.

Therefore, the electronic package 2, 2′, 3, 4, 5, 6 of the presentdisclosure employs the bonding wire portions 220, 320, 420, 520 stitchbonded onto the carrier 20 as the shielding structure 22, 32, 42, 52 toprevent influences of temperature, humidity and other environmentalfactors. Therefore, compared to the prior art, the electronic package 2,2′, 3, 4, 5, 6 of the present disclosure is capable of effectivelypreventing the shielding structure 22, 32, 42, 52 from peeling off orfalling off the carrier 20.

In addition, the shielding structure 22, 32, 42, 52 is encapsulated bythe packaging layer 23, so the size and shape of the shielding structure22, 32, 42, 52 does not have to conform to the size and shape of thepackaging layer 23, rendering precision manufacturing processunnecessary. Therefore, compared to the prior art, accuracy in therelative positions between the shielding structure 22, 32, 42, 52 andthe packaging layer 23 of the electronic package 2 of the presentdisclosure is no longer a concern, thereby significantly reducingmanufacturing cost and time.

Moreover, since the carrier 20 is already defined with the chipplacement area A and the periphery area B, so compared to the prior art,when the electronic package 2, 2′, 3, 4, 5, 6 of the present disclosureis provided with an electronic component 21 of a different size andshape, it is not necessary to manufacture another packaging layer 23 ofa different size and shape, and in turn, there is no need for making anew mold, thereby further lowering manufacturing cost and time.

The above embodiments are set forth to illustrate the principles of thepresent disclosure, and should not be interpreted as to limit thepresent disclosure in any way. The above embodiments can be modified byone of ordinary skill in the art without departing from the scope of thepresent disclosure as defined in the appended claims.

1. An electronic package, comprising: a carrier; an electronic componentdisposed on the carrier; and a shielding structure including a pluralityof bonding wire portions, each of the bonding wire portions beingprovided on the carrier by continuous wire bonding, wherein the bondingwire portion has an arc line shape and is defined with a first linesegment, a second line segment and a curved segment connected with thefirst line segment and the second line segment.
 2. The electronicpackage of claim 1, wherein a length of the first line segment and alength of the second line segment are not equal.
 3. The electronicpackage of claim 1, wherein the bonding wire portion is a single linesegment.
 4. The electronic package of claim 1, wherein the shieldingstructure forms a closed loop.
 5. The electronic package of claim 1,further comprising a packaging layer encapsulating the electroniccomponent and the shielding structure.
 6. The electronic package ofclaim 5, wherein the shielding structure is partially exposed from thepackaging layer.
 7. The electronic package of claim 5, furthercomprising a shielding layer formed on the packaging layer.
 8. Theelectronic package of claim 7, wherein the shielding layer iselectrically connected with the carrier.
 9. The electronic package ofclaim 7, wherein the shielding layer is in contact with the shieldingstructure.
 10. The electronic package of claim 7, wherein the shieldinglayer is not in contact with the shielding structure.
 11. The electronicpackage of claim 1, wherein all of the plurality of bonding wireportions are continuously wire bonded to integrally form the shieldingstructure. 12.-22. (canceled)